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Shenzhen Hiner Technology Co.,LTD.
Shenzhen Hiner Technology Co.,LTD.
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Shenzhen Hiner Technology Co.,LTD. Factory Production Line

Production Line

Hiner-Pack has many years of design and manufacturing experience in the field of injection molding products. We have produced a wide range of injection molding packaging products to meet the requirements of automation equipment for many semiconductor design and testing customers.

 

Hiner-Pack is committed to the development and design of the most advanced Jedec Tray,IC Tray,Wafer Shipping Box..etc, the company has advanced mold processing and injection molding equipment.Equipped with a variety of testing equipment, to ensure product quality.Hiner-Pack designs and manufactures products that provide a complete range of levels of electrostatic protection for IC chips, modules and wafers, as well as a safe and convenient mode of transportation.A variety of materials are available to meet customers' requirements of temperature resistant baking.

 

 

Shenzhen Hiner Technology Co.,LTD. factory production line 0

Shenzhen Hiner Technology Co.,LTD. factory production line 1

OEM/ODM

Hiner-pack established in Shenzhen,China, independent injection molding production line, one-stop service from mold research and development to product production, to meet the reasonable requirements of customers, the production of high-quality products in line with the requirements of the industry, professional packaging advice, to provide effective packaging for your products.

 

Hiner-pack focuses on product protection and pollution control during wafer manufacturing production and transportation.

Wafers are the highest end of the product and are also the most vulnerable,all products researched and manufactured by Hiner-pack is applied to different manufacture processes,raw materials and different production processing in wafer manufacture,which achieves the maximum protection against damage and contamination during production and transportation.

Shenzhen Hiner Technology Co.,LTD. factory production line 0

Shenzhen Hiner Technology Co.,LTD. factory production line 1

R&D

The main consideration of wafer packaging box development

 

Maximal realization to packaging density, High cleanliness,Low ion content

Maximization Impact resistance design protection to wafer breakage

Maximal realization to protect wafer Low gas release from organic contamination

Design conforms to the automatic High impact resistance interface of process equipment

Shenzhen Hiner Technology Co.,LTD. factory production line 0