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Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future

Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future

2025-03-18

March 26–28, 2025 | Shanghai New International Expo Center | Booth E6-6725

Shenzhen Hiner Advanced Materials Application Technology Co., Ltd. (Shenzhen Hiner Technology Co., LTD.) is thrilled to announce its participation in SEMICON China 2025, Asia’s premier event for the semiconductor and display industries. Under the theme CONNECT•COLLABORATE•INNOVATE this year’s exhibition will unite global innovators to shape the future of technology—and we invite you to join us at Booth E6-6725 to explore cutting-edge solutions in semiconductor packaging materials.

Our team of experts will be on-site to discuss how our products empower efficiency, reduce environmental impact, and drive technological breakthroughs.

Event Details

Dates: March 26–28, 2025

Location: Shanghai New International Expo Centre

Booth: E6-6725

Theme: CONNECT•COLLABORATE•INNOVATE 

Let’s Innovate Together

SEMICON China 2025 is more than an exhibition—it’s a platform to connect with industry pioneers, share knowledge, and inspire progress. Whether you’re a manufacturer, engineer, or tech visionary, we welcome you to visit Hiner-Pack’s booth and discover how our advanced materials can elevate your projects.

latest company news about Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future  0

banner
Blog Details
Created with Pixso. Home Created with Pixso. Blog Created with Pixso.

Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future

Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future

March 26–28, 2025 | Shanghai New International Expo Center | Booth E6-6725

Shenzhen Hiner Advanced Materials Application Technology Co., Ltd. (Shenzhen Hiner Technology Co., LTD.) is thrilled to announce its participation in SEMICON China 2025, Asia’s premier event for the semiconductor and display industries. Under the theme CONNECT•COLLABORATE•INNOVATE this year’s exhibition will unite global innovators to shape the future of technology—and we invite you to join us at Booth E6-6725 to explore cutting-edge solutions in semiconductor packaging materials.

Our team of experts will be on-site to discuss how our products empower efficiency, reduce environmental impact, and drive technological breakthroughs.

Event Details

Dates: March 26–28, 2025

Location: Shanghai New International Expo Centre

Booth: E6-6725

Theme: CONNECT•COLLABORATE•INNOVATE 

Let’s Innovate Together

SEMICON China 2025 is more than an exhibition—it’s a platform to connect with industry pioneers, share knowledge, and inspire progress. Whether you’re a manufacturer, engineer, or tech visionary, we welcome you to visit Hiner-Pack’s booth and discover how our advanced materials can elevate your projects.

latest company news about Join Us at SEMICON China 2025: Pioneering Advanced Materials for a Connected Future  0