Under the guidance of the Shenzhen Municipal Government and the support of the Shenzhen Development and Reform Commission, the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, together with Shenzhen Major Industry Investment Group Co., Ltd., jointly organized the first "SEMiBAY Bay Chip Exhibition" - Bay Area Semiconductor Industry Ecological Expo, which will grandly open from October 16th to 18th this year.
Six Exhibition Areas, Gathering New Industry Products
Shenzhen Pavilion Shows the "Core" Pattern of the Bay Area
Appreciate the new trends in cutting-edge technological development
At this exhibition, visitors can personally experience cutting-edge semiconductor technologies and application trends such as RISC-V, Chiplets and advanced packaging, silicon carbide, AI chips, and AI big models through on-site exhibitions by exhibitors or expert speeches at technology forums. Wanxin Exhibition will be a platform for showcasing these latest technologies and more innovative applications.
Hiner-pack was founded in 2013,|t is a comprehensive one-stop supplier of packaging and transportation products integrating design, manufacturing and production. Our products serve loading and shipment functions in wafer manufacturingas important automatic transmission IC chip packaging and testing process.
Hiner-pack focuses on product protection and pollution control during the production and transportation of wafer manufacturing. Wafers are the most high-end products and the most vulnerable. The products developed and produced by Hiner-pack support the application of different processes, raw materials and different production processes in wafer manufacturing. Achieve maximum protection against breakage and pollution during wafer production and transportation.
Design in line with JEDEC international standards, strong versatility; The flexible design of the load tray assembly groove provides better protection for different chip bottom edge welding balls and pins; Various series of materials for customers to choose, to meet customer ESD and baking requirements; Optimized product design can provide better protection for IC in various packaging modes while reducing transportation costs.
Hiner-pack's Chip Tray&Waffle Pack family provides a safe and convenient way to pack and transport chips, dies, COGs, bar bars, optoelectronic devices and other microelectronic parts. Available in a variety of sizes and materials, the product specifications include: 2 inch, 3 inch, and 4 inch. It can also be customized according to the special requirements of customers.
Hope you can learn something from this exhibition and look forward to your arrival!
Under the guidance of the Shenzhen Municipal Government and the support of the Shenzhen Development and Reform Commission, the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, together with Shenzhen Major Industry Investment Group Co., Ltd., jointly organized the first "SEMiBAY Bay Chip Exhibition" - Bay Area Semiconductor Industry Ecological Expo, which will grandly open from October 16th to 18th this year.
Six Exhibition Areas, Gathering New Industry Products
Shenzhen Pavilion Shows the "Core" Pattern of the Bay Area
Appreciate the new trends in cutting-edge technological development
At this exhibition, visitors can personally experience cutting-edge semiconductor technologies and application trends such as RISC-V, Chiplets and advanced packaging, silicon carbide, AI chips, and AI big models through on-site exhibitions by exhibitors or expert speeches at technology forums. Wanxin Exhibition will be a platform for showcasing these latest technologies and more innovative applications.
Hiner-pack was founded in 2013,|t is a comprehensive one-stop supplier of packaging and transportation products integrating design, manufacturing and production. Our products serve loading and shipment functions in wafer manufacturingas important automatic transmission IC chip packaging and testing process.
Hiner-pack focuses on product protection and pollution control during the production and transportation of wafer manufacturing. Wafers are the most high-end products and the most vulnerable. The products developed and produced by Hiner-pack support the application of different processes, raw materials and different production processes in wafer manufacturing. Achieve maximum protection against breakage and pollution during wafer production and transportation.
Design in line with JEDEC international standards, strong versatility; The flexible design of the load tray assembly groove provides better protection for different chip bottom edge welding balls and pins; Various series of materials for customers to choose, to meet customer ESD and baking requirements; Optimized product design can provide better protection for IC in various packaging modes while reducing transportation costs.
Hiner-pack's Chip Tray&Waffle Pack family provides a safe and convenient way to pack and transport chips, dies, COGs, bar bars, optoelectronic devices and other microelectronic parts. Available in a variety of sizes and materials, the product specifications include: 2 inch, 3 inch, and 4 inch. It can also be customized according to the special requirements of customers.
Hope you can learn something from this exhibition and look forward to your arrival!
