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Wafer Foam
Created with Pixso. Wafer Frame Special Standard Foam Padding Buffing Pads Thickness 5 - 10mm

Wafer Frame Special Standard Foam Padding Buffing Pads Thickness 5 - 10mm

Brand Name: Hiner-pack
Model Number: HWS-HN100~200mm-Round Foam
MOQ: 500PCS(Negotiable)
Price: Prices vary with delivery methods and quantities
Delivery Time: 1~2 Weeks
Payment Terms: 100% Prepayment
Detail Information
Place of Origin:
China
Certification:
ISO 9001 ROHS
Thickness:
5mm(A Variety Of Options)
Origin:
China
Breathability:
High
Property*1:
No Organic Pollution
Brand:
Hiner-pack
Shape:
Round
Property*2:
Good Shock Resistance
Color:
Pink
Packaging Details:
Inner Bag
Supply Ability:
About 2000Pcs Per Day
Highlight:

Wafer round foam padding

,

5mm foam buffing pads

,

10mm foam buffing pads

Product Description

Product Description:

Product Overview: Wafer Foam
Surface Resistance*1: 1.0*10E4~1.0*10E11Ω

Wafer Foam, also known as Foam Cushion Pad, is a highly versatile and essential product for the semiconductor industry. It is designed to provide a safe and protective environment for delicate wafers during shipping and storage. With its excellent surface resistance, Wafer Foam ensures the safety and integrity of wafers, making it an indispensable component in wafer shippers and buffers.

Name: Foam Cushion Pad

Our Wafer Foam is also commonly known as Foam Cushion Pad due to its soft and cushioning nature. This name accurately reflects its function as a protective layer for wafers, shielding them from any potential damage or contamination.

Wafer Frame Special Standard Foam Padding Buffing Pads Thickness 5 - 10mm 0Features:

  • Product Name: Wafer Foam
  • Surface Resistance*1: 1.0*10E4~1.0*10E11Ω
  • Durability: High
  • Property*2: Good Shock Resistance
  • Shape: Round
  • Breathability: High
  • Shock Absorption
  • Pink Color
  • Different Thicknesses Are Available

 

Technical Parameters:

 

Property Value
Name Foam Cushion Pad
Material ESD Polymer And PP Foam Material
Size 4-12 Inch/100-300mm
Breathability High
Origin China
Brand Hiner-pack
Property*1 No Organic Pollution
Shape Round
Durability High
Property*2 Good Shock Resistance
Key Features Keywords
Non-pollution No Organic Pollution
Shock Absorption High, Good Shock Resistance
In Light Weight High

 

Applications:

 

Wafer Foam - Perfect Solution for Semiconductor Manufacturing

Are you looking for a reliable and high-quality wafer foam for your semiconductor manufacturing process? Look no further than Hiner-pack's Wafer Foam, the perfect solution for buffering wafers during the production process.

Our Wafer Foam, also known as buffer foam, is specifically designed to provide excellent shock resistance and breathability, making it an ideal choice for protecting delicate wafers in semiconductor manufacturing.

 

Non-pollution: Our Wafer Foam is made with non-toxic and environmentally friendly materials, ensuring that it does not harm the environment or pose any health risks.

Buffer Foam: Our Wafer Foam serves as a buffer and shock absorber, protecting delicate wafers during transport and handling.

Placed Horizontally In The Wafer Shipper: Our Wafer Foam is specifically designed to fit perfectly inside wafer shippers, ensuring that the wafers are kept safely in a horizontal position during shipping.

Wafer Frame Special Standard Foam Padding Buffing Pads Thickness 5 - 10mm 1

FAQ:

Frequently Asked Questions
  • Q: How much does this product cost?
  • A: The price of this product varies depending on the delivery method and quantity ordered.
  • Q: How is this product packaged?
  • A: This product is packaged in an inner bag.
  • Q: What is the delivery time for this product?
  • A: The delivery time for this product is 1 to 2 weeks.
  • Q: What are the payment terms for this product?
  • A: The payment terms for this product is 100% prepayment.
  • Q: What is the supply ability for this product?
  • A: The supply ability for this product is about 2000Pcs per day.