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300mm FOSB
Created with Pixso. 12 Inch 300mm FOSB Wafer Carrier With Standard Automation Device Interface

12 Inch 300mm FOSB Wafer Carrier With Standard Automation Device Interface

Brand Name: Hiner-pack
Model Number: RFOSB-HN300mm/12 Inch
MOQ: 50PCS(Negotiable)
Price: Prices vary with delivery methods and quantities
Delivery Time: 2~3 Weeks
Payment Terms: 100% Prepayment
Detail Information
Place of Origin:
China
Certification:
ISO 9001 ROHS
Product Name:
300mm FOSB
Color:
Transparent Color
Clean:
100 Class Workshop
Material:
Main Plastic
Shape:
Square
Capacity:
25PCS
Packaging Details:
Inner Bag
Supply Ability:
TBC
Highlight:

300mm FOSB Wafer Carrier

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12 inch FOSB Wafer Carrier

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300mm FOSB With Interface

Product Description

Product Description:

 

FOSB Wafer Carrier With Standard Automation Device Interface

 

FOSB wafer carriers play a crucial role in the semiconductor supply chain by ensuring that wafers are transported and stored safely while maintaining the required cleanliness standards.

What should I pay attention to when using FOSB Wafer Carrier

 

 

When using FOSB (Front Opening Shipping Box) wafer carriers, it's important to pay attention to the following key aspects:

 

Cleanroom Protocols

Follow strict cleanroom procedures to minimize contamination. Ensure personnel wear appropriate cleanroom attire and adhere to hygiene practices.

 

Handling Procedures

Use correct handling techniques to avoid mechanical damage. Always handle FOSBs by the designated areas and avoid touching the wafer surfaces.

 

Inspection Before Use

Regularly inspect FOSBs for signs of damage, contamination, or wear. Ensure they are clean and intact before loading wafers

Features:

 

After each use, it is important to thoroughly clean the door and shell. Additionally, it is necessary to replace the door gasket and wafer cushion to ensure optimal performance of the system.

Finally, it is important to inspect the FOSB for any damage or excessive wear before any reuse.

12 Inch 300mm FOSB Wafer Carrier With Standard Automation Device Interface 0

Technical Parameters:

 
What is FOSB Wafer?

In the process of semiconductor manufacturing, FOSB (Front Opening Shipping Box) are utilized for transferring wafers between machines or factories. This is to maintain cleanliness and safeguard against damage.

An additional precaution is implemented by using an Anti-Static Shielding Bag to protect the wafers.

 

The FOSB are specially designed for wafers and are constructed with a cleanroom-grade, stainless steel material. Test results have concluded that corrosion and surface contamination are eliminated with its usage.

Furthermore, FOSB must be routinely inspected to ensure conformance to the stringent standard.

 

Applications:

Applications(FOSB wafer carriers are primarily used in)
Semiconductor fabrication plants (fabs)
Wafer testing facilities
Research and development labs
12 Inch 300mm FOSB Wafer Carrier With Standard Automation Device Interface 1

Support and Services:

 

300mm FOSB Technical Support and Service

Provide 24/7 online technical support

Provide technical advice and guidance on installation and operation of the product

Provide spare parts and maintenance services

Provide software updates and upgrades

Provide after-sales service and troubleshooting

Provide training and consulting services