12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Product Description:

•  Heat treatment process Wafer ring has good resistance to rebound after heat treatment.

•  Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small.

•  Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.)

Feature:

Advantage:

♦ Adopting heat treatment technology, it has strong bending resistance, toughness and durability, and can be reused repeatedly.

♦ Good adhesion, high flatness, not easy to bubble, good adhesion.

♦ Carefully polished, the surface is smooth and free of burrs, ensuring safe and reliable use.

Application:

•  Lon implantation process:The stainless steel tension ring on the wafer can firmly clamp the wafer during ion implantation, allowing it to accurately receive ion beam implantation.

•  Manufacturing of battery cells:It can fix the silicon wafer in the corresponding equipment, ensuring the accuracy and consistency of the process.

   Laser cutting with high accuracy               Surface electropolishing treatment 

Packing and Shipping:

Adopt moisture-proof, shock-proof and pressure-proof packing method.

• Choose sturdy cartons, wooden boxes or iron drums and other packaging containers.
• Fill the interior with cushioning materials such as foam, bubble bags,Label the outer package with product information, delivery address, etc.

​Choose a regular international logistics company.

• According to the mode of transportation (sea, air, etc.) to do a good job of storage, loading and unloading
• Maintain temperature and humidity control throughout the transportation of goods. Properly handle the return and exchange of goods due to transportation damage.