Hiner-pack has many years of design and manufacturing experience in injection-molded products. We produce a wide range of packaging solutions to meet the automation requirements of semiconductor design and testing companies.
Hiner-pack is committed to developing and designing advanced JEDEC Trays, IC/Chip Trays, and Wafer Carrier Products. The company is equipped with state-of-the-art mold processing and injection molding machines, along with a variety of testing equipment to ensure product quality. Our products offer a full range of electrostatic protection levels for IC chips, modules, and wafers, while also ensuring safe and convenient transportation. Multiple material options are available to meet customer requirements for high-temperature baking.
Established in Shenzhen, China, Hiner-pack operates independent injection molding production lines and provides one-stop services from mold R&D to product manufacturing. We deliver high-quality products that meet industry standards, while also offering professional packaging advice and effective OEM/ODM solutions tailored to customer requirements.
With years of industry experience and active R&D exploration, our factory has independently developed a variety of effective anti-static raw materials. Colored raw materials are also available to meet customers’ high standards and specific requirements. This diversity in material development provides strong support for adapting to different product characteristics.