Why Waffle Pack Uses ABS Material (Acrylonitrile Butadiene Styrene)
Impact Resistance
ABS offers excellent toughness and impact resistance.
Waffle packs made with ABS can withstand mechanical shocks during shipping and handling without cracking.
Dimensional Stability
ABS maintains structural integrity under normal operating conditions.
Ensures pocket accuracy and tray flatness required for chip protection.
Good Processability
ABS is easy to mold into precise pocket designs.
This ensures compatibility with automated pick-and-place systems.
Cost-Effective Choice
Compared with engineering plastics like PC or PES, ABS provides a balance between performance and affordability.
Well-suited for high-volume chip packaging.
ESD-Compatibility
ABS can be compounded with conductive fillers or antistatic agents.
Surface resistivity can be controlled for safe chip handling.
• IC chips and bare die storage & transport.
• Sampling and R&D packaging for semiconductors.
• Cost-sensitive chip packaging solutions.
• Automated handling in assembly and testing lines.
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236
