JEDEC Tray For LGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with LGA Packaging

Absolutely do not contact the exposed lands/contact surfaces: No positioning/supporting surface should contact or apply pressure to the bottom lands.

Prefer supporting by the package body edges: use annular shoulders or four-point/multi-point package body support to keep the bottom lands fully suspended or within a protective recessed area without contact.

Ensure compatibility with automated picking and placement and visual inspection (AOI/X-ray). Maintain good ESD control and material thermal stability (oven/MSL).

Land Grid Array (LGA):

LGA uses a flat bottom array of metal lands as the connection interface, achieving electrical conduction through pressure welding or socket connection. LGA packaging employs elastic cushioning materials to prevent scratches on metal contact surfaces. Meanwhile, the tray features precise guiding and positioning pillars to ensure precise docking with the socket.