JEDEC Tray For RFIC

Reference Factors for Designing Trays for RFICs

Absolutely do not contact any RF-sensitive surfaces (antenna/output port/exposed die/solder pad/bond-pad).

Use the body for support to avoid transmitting mechanical/thermal/electrical stress to the RF chip.

The material and structure should minimize stray electromagnetic and magnetic contamination and ionic/particulate contamination, ensuring compatibility with testing, baking, and production line interfaces.

Meanwhile, ensure that the tray has sufficient mechanical strength to withstand certain pressures and impacts, preventing deformation or damage due to external forces during handling, storage, and automated production processes, thereby protecting the chip from physical damage. The tray's structural design should ensure stable placement of the chip in the tray, avoiding displacement or shaking during movement. Strictly control the tray's dimensional accuracy to ensure precise matching with the chip dimensions, ensuring that the chip can be accurately and stably placed in the designated position on the tray. Additionally, the tray's outer dimensions and structure should be compatible with subsequent production and testing equipment, facilitating automated loading, unloading, and testing processes.