Hiner-pack Waffle Pack Chip Trays are engineered for the secure handling and packaging of bare dies, chips, and small semiconductor devices. To meet diverse operational and branding needs, these trays are available with custom color options beyond the standard black. Color-coded trays not only simplify product identification and inventory management but also enhance workflow efficiency in automated handling environments. Each tray is designed for compatibility with automated handling, inspection, and pick-and-place systems, ensuring reliability from assembly to final packaging.
• Semiconductor wafer and die packaging.
• R&D, sampling, and production processes.
• Automated assembly and inspection lines.
• Inventory management and product classification.
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236
