Why Waffle Pack Uses ABS Material (Acrylonitrile Butadiene Styrene)
Impact Resistance
ABS delivers robust toughness and shock absorption. Trays molded from ABS endure routine handling and transit without fracturing or deforming.
Dimensional Stability
Under typical storage and operating conditions, ABS preserves flatness and cavity geometry, helping keep each pocket correctly aligned to safeguard chips.
Good Processability
The resin flows well during molding, allowing fine pocket features and consistent surface finish—an advantage for precision carriers.
Cost-Effective Choice
Against higher-priced resins such as PC or PES, ABS offers an economical balance of mechanical strength and manufacturing ease, ideal for large production runs.
ESD-Compatibility
Formulations can incorporate carbon or antistatic agents so surface resistivity meets semiconductor handling standards.
• Transport and storage of integrated circuits or singulated dice.
• Sample dispatch, lab builds, and development packaging.
• High-volume, cost-sensitive chip logistics.
• Pick-and-place operations in assembly or sort lines.
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
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