JEDEC Tray For QFN Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFN Packaging

Do not contact the solder pads/exposed thermal pad and lead surface: No support/positioning surface of the tray should press on the bottom exposed metal pad or lead end face.

Stably support the package body while ensuring free space for the solder pad/bottom surface.

Ensure compatibility with automated loading/unloading (picking/vision/stacking/oven) and ESD control.

Quad Flat No-lead (QFN):

QFN is a surface-mount package without exposed leads, achieving electrical connection and heat dissipation through the bottom central pad and surrounding pads. The pad area accounts for over 60% of the package bottom, with a thermal conductivity coefficient of up to 50W/. Its package thickness can be as thin as 0.8mm, making it suitable for space-constrained portable devices such as smartphone RF modules and sensor chips.