Reference Factors for Designing JEDEC TRAYs Compatible with QFN Packaging
Do not contact the solder pads/exposed thermal pad and lead surface: No support/positioning surface of the tray should press on the bottom exposed metal pad or lead end face.
Stably support the package body while ensuring free space for the solder pad/bottom surface.
Ensure compatibility with automated loading/unloading (picking/vision/stacking/oven) and ESD control.
Quad Flat No-lead (QFN):
QFN is a surface-mount package without exposed leads, achieving electrical connection and heat dissipation through the bottom central pad and surrounding pads. The pad area accounts for over 60% of the package bottom, with a thermal conductivity coefficient of up to 50W/. Its package thickness can be as thin as 0.8mm, making it suitable for space-constrained portable devices such as smartphone RF modules and sensor chips.
Widely used for the packaging, storage, and transportation of IC packages, semiconductor chips, electronic modules, and optical devices.
| Material | MPPO, PEI, PES, PPE, ABS, etc. | Outline Size (LxWxT) | 322.6x135.9x7.62mm ("T" is customizable) |
| Package Type | BGA, DIP, QFN, QFP, LGA, SOP, etc. | Cavity Size | Customizable |
| Color | Black, Red, Yellow, Green, White, etc. | Cavity Quantity | Customizable |
| Mold Type | Injection Molding | Flatness/Warpage | MAX 0.76mm |
| Surface Resistance | 1.0x104~1.0x1011Ω/sq | Certificate | RoHS |
| Service | Accept OEM and ODM | ||
| Design | Based on original samples, or custom designs can be created | ||
| Packing | By carton or according to customer’s request | ||
| Sample | Sample charge: 1. Free for stock samples 2. Custom tray samples to be negotiated Sample time: After the draft is confirmed and payment is arranged | ||
| Lead Time | 5-7 Working days (The exact lead time depends on the order quantity) | ||
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