Why Waffle Pack Uses PC Material (Polycarbonate)
High Impact Strength
PC provides superior toughness compared with ABS.
Ensures chip safety during vibration, shipping, and stacking.
Dimensional Accuracy
Low warpage and high stiffness maintain cavity precision.
Supports consistent stacking and automated handling.
Thermal Resistance
PC can handle moderate heating processes (up to ~120 °C).
Suitable for environments where trays may be exposed to elevated temperatures.
ESD Performance
Like ABS, PC can be modified with conductive or antistatic additives.
Surface resistivity can be tuned for semiconductor applications.
Excellent Transparency
PC can be manufactured as transparent covers/lids, allows easy chip inspection without removing covers/lids.
• High-value ICs, sensors, and optoelectronic components.
• Chips requiring visual inspection during storage.
• Packaging for devices sensitive to vibration or impact.
• Automated testing and assembly with transparent tray monitoring.
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
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