Cases

1. Vacuum-Formed VS Injection-MoldedComparison CriteriaVacuum-FormedInjection-MoldedManufacturing ProcessA flat plastic sheet, such as PET or PS, is heated until softened, formed over a mold using vacuum pressure, and then cooled to retain the desired shape.Plastic resin is melte ...

Stopping the Shakes: How We Prevent Wafer CrackingWhen wafers travel across the globe by air or truck, they face constant vibrations. These aren't just bumps; they are high-frequency shakes that can cause the edges of a wafer to chip or tiny cracks to form. To solve this, a well- ...

The Engineering Behind the Wafer Jar: Handling Batch SamplesFor research labs and pilot production lines, the Wafer Jar is a versatile and widely used solution for multi-wafer handling. Made from high-purity polypropylene or other low-outgassing polymers, these containers are des ...

Baking Duration and Material Creep ResistanceAccording to JEDEC standards, bakeable trays must undergo 48 hours of continuous baking without violating dimensional tolerances. In practice, baking is often performed at 125∘C to remove moisture from MSL components. However, choosing ...

1. Vibration: Micro-Movement and Edge StressDuring long-distance transportation—whether by air or sea—packages are continuously exposed to low-level vibrations. While wafers are securely held inside carriers, they are not perfectly immobilized.If the pocket design, slot geometry, ...

Customer Overview and Project Background G Company, a semiconductor materials and chip R&D enterprise with a solid background, procured a batch of 6-inch wafer expansion rings from our company in May 2025 for wafer expansion development and wafer transportation testing. No issue ...

Customer Overview and Project BackgroundH Company is a semiconductor R&D enterprise that has maintained a good cooperative relationship with our company for the past five years. In March 2024, H Company planned to purchase a batch of 8-inch vertical frame boxes from our company f ...

Aluminum alloy material is the most commonly used material for making product molds in Hiner-pack, at the same time, it is also a kind of price and nature of stable characteristics. It has the following advantages:1. low density and high strength: the density of aluminum alloy is ...

In the process of production, research, and development, our company provides customized packaging solutions for many customers' chips. The pocket size designed this time specifically corresponding to the IC size, which is only 14*0.21*0.1mm.Compared with the conventional chip si ...

Facing the changing environment and the changing market demand, we would like to meet different difficulty challenge, day and night to meet customer demand for products, but also to the promotion of the company production capacity ,which can provide customers with effective packi ...