Cases

Customer Overview and Project Background G Company, a semiconductor materials and chip R&D enterprise with a solid background, procured a batch of 6-inch wafer expansion rings from our company in May 2025 for wafer expansion development and wafer transportation testing. No issu ...

Customer Overview and Project BackgroundH Company is a semiconductor R&D enterprise that has maintained a good cooperative relationship with our company for the past five years. In March 2024, H Company planned to purchase a batch of 8-inch vertical frame boxes from our company f ...

Aluminum alloy material is the most commonly used material for making product molds in Hiner-pack, at the same time, it is also a kind of price and nature of stable characteristics. It has the following advantages:1. low density and high strength: the density of aluminum alloy is ...

In the process of production, research, and development, our company provides customized packaging solutions for many customers' chips. The pocket size designed this time specifically corresponding to the IC size, which is only 14*0.21*0.1mm.Compared with the conventional chip si ...

Facing the changing environment and the changing market demand, we would like to meet different difficulty challenge, day and night to meet customer demand for products, but also to the promotion of the company production capacity ,which can provide customers with effective packi ...