Reference Factors for Designing JEDEC TRAYs Compatible with QFP Packaging
Firstly, the body dimensions, lead tip-to-tip spacing, and lead height serve as the foundation. The tray cavity design should prioritize protecting the leads.
The side wall "shoulder/step" is used to support the body, avoiding any tray surface from touching the leads, reducing the contact area and chip movement. At the same time, it provides force support to prevent vibration of the product within the tray.
Quad Flat Package (QFP):
QFP is a classic surface-mount package characterized by leads extending in a gull-wing (L) shape from the four sides of the package body at equal intervals. The number of leads typically ranges from 32 to 304, with a lead pitch as low as 0.4mm. This package structure, bonded to the chip through a metal frame, offers excellent electrical performance and heat dissipation capabilities, suitable for digital logic chips, microcontrollers, and other devices with medium pin counts.
Widely used for the packaging, storage, and transportation of IC packages, semiconductor chips, electronic modules, and optical devices.
| Material | MPPO, PEI, PES, PPE, ABS, etc. | Outline Size (LxWxT) | 322.6x135.9x7.62mm ("T" is customizable) |
| Package Type | BGA, DIP, QFN, QFP, LGA, SOP, etc. | Cavity Size | Customizable |
| Color | Black, Red, Yellow, Green, White, etc. | Cavity Quantity | Customizable |
| Mold Type | Injection Molding | Flatness/Warpage | MAX 0.76mm |
| Surface Resistance | 1.0x104~1.0x1011Ω/sq | Certificate | RoHS |
| Service | Accept OEM and ODM | ||
| Design | Based on original samples, or custom designs can be created | ||
| Packing | By carton or according to customer’s request | ||
| Sample | Sample charge: 1. Free for stock samples 2. Custom tray samples to be negotiated Sample time: After the draft is confirmed and payment is arranged | ||
| Lead Time | 5-7 Working days (The exact lead time depends on the order quantity) | ||
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