Hiner-pack Waffle Pack Trays are purpose-built for safe handling of semiconductor dice, chips, and miniature devices. To streamline operations and align with user preferences, the trays can be molded in several colors beyond the standard black. Visual coding supports fast line identification, simplifies stock segregation, and improves workflow in automated systems. Every tray is engineered for smooth interface with robotic pickers, inspection cameras, and other packaging automation, ensuring stable performance across manufacturing stages.
• Packaging and handling of semiconductor dice and wafers.
• Prototype, sampling, and production environments.
• Automated testing, assembly, and inspection setups.
• Color-based stock organization and part tracking.
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236
