4-inch Waffle Pack / Chip Tray in Various Colors

4-inch Waffle Pack/Chip Tray in Various Colors

- Wide range of color selections (black, white, gray, yellow, etc.)
- Optimized geometry for chips, bare die, and micro devices
- Fully compatible with automation and vision equipment
- Durable antistatic resins safeguard ESD-sensitive parts
- Color coding enhances identification and line management

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Description

Hiner-pack Waffle Pack Trays are purpose-built for safe handling of semiconductor dice, chips, and miniature devices. To streamline operations and align with user preferences, the trays can be molded in several colors beyond the standard black. Visual coding supports fast line identification, simplifies stock segregation, and improves workflow in automated systems. Every tray is engineered for smooth interface with robotic pickers, inspection cameras, and other packaging automation, ensuring stable performance across manufacturing stages.

Reference Materials

Hiner-pack® 4-inch Waffle Pack & Chip Tray Catalog.pdf

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Application

• Packaging and handling of semiconductor dice and wafers.

• Prototype, sampling, and production environments.

• Automated testing, assembly, and inspection setups.

• Color-based stock organization and part tracking.

Specifications

Material	Surface Resistance	Color	Matrix QTY	Pocket Size
ABS / PC (Customizable)	1.0x10⁴~1.0x10¹¹Ω/sq	Customizable	Customizable	Customizable

Outline Size	2"	3"	4"	Customized Size
Warpage	Max 0.2mm	Max 0.25mm	Max 0.3mm	TBC
Features	Durable, Reusable, Eco-friendly, Biodegradable
Sample	1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements
Accessories	Cover/Lid, Clip/Clamp, Tyvek® paper
Artwork Format	PDF, 2D, 3D

4-inch Waffle Pack/Chip Tray in Various Colors

Description

Reference Materials

Hiner-pack® 4-inch Waffle Pack & Chip Tray Catalog.pdf

Application

Specifications

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