QFN Lead Frame Magazine Wafer Riveting Magazing

QFN Lead Frame Magazine

- Manufacturing raw materials through SGS testing standards, strong and durable, with 5+ years of service life
- The finished product has high precision and flatness, with stable quality in batch processing
- Surface hard oxidation, heat/corrosion/stain-resistant, dustproof, long-term use as new
- Custom oxidation color

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Description

The QFN Lead Frame Magazine is made of high-quality 6061 aluminum profiles, precision machined through CNC processing, surface anodizing treatment, assembly verification, and other processes. The overall precision of the magazing reaches ±0.01mm, with flatness up to ±0.05mm. The product is sturdy, durable, and has a long service life of over 5 years. The surface and grooves are smooth and burr-free, ensuring that the material does not get stuck during the manufacturing process, making it an excellent tool for improving production efficiency in packaging and testing workshops. It meets the technical parameters required by mainstream wire bonding machines and is ready for immediate use.

Reference Materials

Hiner-pack® Metal Wafer Cassette Catalog.pdf

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Application

• Consumer Electronics and Telecommunications: QFN packages are widely used in these sectors due to their compact size and good electrical and thermal performance. The lead frame magazine plays a vital role in the cost-effective mass production of these devices.

• Automotive Industry: High-reliability sectors like automotive also utilize QFN packages, making consistent assembly processes, supported by magazines, indispensable for meeting strict quality standards.

• Maintaining High Yields: By ensuring reliable feeding and placement of QFNs, the magazines contribute to higher assembly yields and reduced manufacturing costs, critical for large-scale production.