JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA Packaging

Absolutely protect the solder balls: No positioning surface of the tray should press, rub, or contact the balls.

Stably support the package body to prevent rotation or displacement during transportation, vibration, or drop.

Ensure compatibility with upstream packaging and testing, downstream placement/sorting machines, material racks/storage system mechanical interfaces.

Ball Grid Array (BGA):

BGA adopts a bottom array of solder balls as the I/O interface, with solder ball diameters typically ranging from 0.76 to 1.0mm and array pitches varying from 1.0mm to 0.4mm, enabling high-density integration of hundreds to thousands of leads. Its core advantages lie in short signal transmission paths and excellent heat dissipation performance. The short leads of the array solder balls shorten the signal transmission path, reduce lead inductance and resistance, and minimize signal transmission delay, greatly improving the operating frequency, improving circuit performance, and being suitable for high-frequency, high-performance chips such as CPUs, GPUs, and FPGAs.