Reference Factors for Designing JEDEC TRAYs Compatible with BGA Packaging
Absolutely protect the solder balls: No positioning surface of the tray should press, rub, or contact the balls.
Stably support the package body to prevent rotation or displacement during transportation, vibration, or drop.
Ensure compatibility with upstream packaging and testing, downstream placement/sorting machines, material racks/storage system mechanical interfaces.
Ball Grid Array (BGA):
BGA adopts a bottom array of solder balls as the I/O interface, with solder ball diameters typically ranging from 0.76 to 1.0mm and array pitches varying from 1.0mm to 0.4mm, enabling high-density integration of hundreds to thousands of leads. Its core advantages lie in short signal transmission paths and excellent heat dissipation performance. The short leads of the array solder balls shorten the signal transmission path, reduce lead inductance and resistance, and minimize signal transmission delay, greatly improving the operating frequency, improving circuit performance, and being suitable for high-frequency, high-performance chips such as CPUs, GPUs, and FPGAs.
Widely used for the packaging, storage, and transportation of IC packages, semiconductor chips, electronic modules, and optical devices.
| Material | MPPO, PEI, PES, PPE, ABS, etc. | Outline Size (LxWxT) | 322.6x135.9x12.19mm ("T" is customizable) |
| Package Type | BGA, DIP, QFN, QFP, LGA, SOP, etc. | Cavity Size | Customizable |
| Color | Black, Red, Yellow, Green, White, etc. | Cavity Quantity | Customizable |
| Mold Type | Injection Molding | Flatness/Warpage | MAX 0.76mm |
| Surface Resistance | 1.0x104~1.0x1011Ω/sq | Certificate | RoHS |
| Service | Accept OEM and ODM | ||
| Design | Based on original samples, or custom designs can be created | ||
| Packing | By carton or according to customer’s request | ||
| Sample | Sample charge: 1. Free for stock samples 2. Custom tray samples to be negotiated Sample time: After the draft is confirmed and payment is arranged | ||
| Lead Time | 5-7 Working days (The exact lead time depends on the order quantity) | ||
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236
