PE Conductive Film/Interleaf

- ESD protected
- Low particle level and ion contamination
- Double-sided embossing
- No layering, wrinkles, warping, cracking, adhesion, or foreign body attached

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Description

ESD-protected, low-particle, low ion contamination. The corrugated surface design suppresses sticking to wafers and compatible with automated machines.

Reference Materials

Hiner-pack® Wafer Carrier Series Catalog.pdf

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Application

Used in conjunction with wafer shipper as a wafer-to-wafer separator.

Specifications

Part Number	Diameter	Thickness
PE-100/T0.1	100mm	0.1mm
PE-150/T0.1	150mm	0.1mm
PE-200/T0.1	200mm	0.1mm
PE-300/T0.1	300mm	0.1mm
PE-360/T0.1	360mm	0.1mm
PE-400/T0.1	400mm	0.1mm
Material	Conductive Polyethylene (PE)
Surface Resistivity	1x10⁵ ~ 1x10⁹Ω