8-inch Horizontal Clamp Ring Wafer Shipper

Designed for secure wafer transport and storage in semiconductor manufacturing processes

As semiconductor technology advances, manufacturers are increasingly using thinner and more delicate wafers, especially in consumer electronics. These ultrathin wafers pose significant handling and transport challenges due to their sensitivity to breakage, warping, and contamination. The 200 mm clamp ring wafer shipper from Hiner-pack® is specifically designed to meet these demands, offering secure storage and transportation for up to 25 wafers of varying thicknesses. Made from high-performance, engineering-grade polymer, the shipper eliminates the need for traditional ESD interleaf like TYVEK® paper and PE film by using individual clamp rings to reduce surface contact and contamination risks. This innovative design minimizes wafer movement, protects edge and surface integrity, and ensures wafers arrive in optimal condition. This clamp ring shipper is ideal for fabs seeking to improve wafer handling efficiency while maintaining cleanliness and reducing damage.