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6-inch Wafer Jar - Transparent Cover

- Interleaf separators prevent direct wafer surface contact
- Foam liners and cushion disks absorb shocks and vibration
- The bottom and the top cover are designed to facilitate the operator to open and ensure safety during transportation

Description

Engineered for safe handling of delicate wafers during shipping and storage

Designed for cost-effective wafer handling, these polypropylene wafer jars are ideal for storing and transporting multiple non-sensitive wafers. The secure lid prevents accidental opening, while internal separators, foam disks, and liner foam walls create a multi-layer protective barrier against mechanical shock, vibration, and direct wafer contact. Available in 150mm and 200mm options, with customized sizes on request, and in clear, white, or black for visual inspection or ESD-safe applications. Their stackable, reusable design makes them an efficient cleanroom storage solution, reducing packaging waste. From semiconductor fabrication plants to wafer distribution, these wafer jars deliver reliable protection and contamination control throughout the process.

Reference Materials

  • Hiner-pack® 6-inch Wafer Jar-Transparent Cover.pdf

    580 kB

Application

Bulk wafer storage and transport

Cleanroom-based manual packing

Multiple wafer protection during shipment

Cost-effective solution for non-sensitive wafer handling

Specifications

BASIC INFORMATION
Part NumberCollocation ReferenceWafer Size
MHWJ-6/25-160/48-NPBottom+Foam+Interleaf+Liner+Top6"/150 mm
MetarialMaximum CapacityColor
PP25Transparent
Delivery TimeUsually 2-3 weeks, depending on order quantity

* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.

TECHNICAL DATA
PROPERTYTEST METHODRATED VALUES
DensityISO 11830.9 g/cm³
Melt IndexISO 113315 g/10min
Melting PointDSC146°C
Distortion TemperatureISO 7595°C
Vicat softening temperatureISO 306125°C
Tensile Strength at YieldISO 527280 kg/m²
Tensile Elongation at BreakISO 527300 %
Rockwell hardness R scaleISO 203998
Tensile Strain at BreakISO 527-2 (50mm/min)10 %
Flexural ModulusISO 17810500 kg/m²
Flow ShrinkageFPC Method1.3~1.7 %
LZOD Impact StrengthISO 180/23°C
ISO 180/-20°C
6 kg.cm/cm
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* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.

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