Why Waffle Pack Uses PC Material (Polycarbonate)
High Impact Strength
Polycarbonate surpasses ABS in toughness, protecting sensitive components from vibration and drop events during handling.
Dimensional Accuracy
Stiffness and low warpage maintain cavity tolerances, supporting reliable stacking and robotic alignment.
Thermal Resistance
PC withstands moderate heating—roughly up to 120 °C—beneficial where trays face slightly elevated process temperatures.
ESD Performance
Antistatic or conductive grades are achievable through filler technology, aligning with semiconductor ESD protocols.
Excellent Transparency
Clear PC tray covers allow direct visual confirmation of die or chip placement without removing covers/clips.
• Premium ICs, MEMS, or sensor die requiring added protection
• Devices sensitive to vibration or impact
• Automated assembly, probing, and test flows needing consistent pocket alignment
| Material | Surface Resistance | Color | Matrix QTY | Pocket Size |
| ABS / PC (Customizable) | 1.0x104~1.0x1011Ω/sq | Customizable | Customizable | Customizable |
| Outline Size | 2" | 3" | 4" | Customized Size |
| Warpage | Max 0.2mm | Max 0.25mm | Max 0.3mm | TBC |
| Features | Durable, Reusable, Eco-friendly, Biodegradable | |||
| Sample | 1. Free Samples – Selected from existing products 2. Customized Samples – Produced according to your design or requirements | |||
| Accessories | Cover/Lid, Clip/Clamp, Tyvek® paper | |||
| Artwork Format | PDF, 2D, 3D | |||
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