4-inch Waffle Pack - PC Material

Why Waffle Pack Uses PC Material (Polycarbonate)

High Impact Strength

Polycarbonate surpasses ABS in toughness, protecting sensitive components from vibration and drop events during handling.

Dimensional Accuracy

Stiffness and low warpage maintain cavity tolerances, supporting reliable stacking and robotic alignment.

Thermal Resistance

PC withstands moderate heating—roughly up to 120 °C—beneficial where trays face slightly elevated process temperatures.

ESD Performance

Antistatic or conductive grades are achievable through filler technology, aligning with semiconductor ESD protocols.

Excellent Transparency

Clear PC tray covers allow direct visual confirmation of die or chip placement without removing covers/clips.