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8-inch Wafer Jar - White Cover

- Interleaf separators prevent direct wafer surface contact
- Foam liners and cushion disks absorb shocks and vibration
- The bottom and the top cover are designed to facilitate the operator to open and ensure safety during transportation

Description

Engineered for safe handling of delicate wafers during shipping and storage

Wafer jars provide an economical and reliable multi-wafer storage and transport solution, ideal for non-sensitive wafers in semiconductor production. Made from durable natural polypropylene, each jar is equipped with a secure-fitting lid to prevent accidental opening. Inside, a layered protection system—including interleaf separators, foam cushion disks, and liner foam walls—shields wafers from vibration, shock, and surface contact. Available in 150mm and 200mm sizes (custom sizes available), and offered in clear, white, or black for inspection or ESD control. Their stackable design optimizes cleanroom space, while the reusable construction reduces packaging waste. Perfect for in-fab storage and inter-fab wafer shipping, these jars ensure contamination prevention and physical protection for high-value wafers.

Reference Materials

  • Hiner-pack® 8-inch Wafer Jar-White Cover.pdf

    617 kB

Application

Bulk wafer storage and transport

Cleanroom-based manual packing

Multiple wafer protection during shipment

Cost-effective solution for non-sensitive wafer handling

Specifications

BASIC INFORMATION
Part NumberCollocation ReferenceWafer Size
MHWJ-8/25-203/50-WHBottom+Foam+Interleaf+Liner+Top8"/200 mm
MetarialMaximum CapacityColor
PP25Transparent Bottom+White Cover
Delivery TimeUsually 2-3 weeks, depending on order quantity

* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.

TECHNICAL DATA
PROPERTYTEST METHODRATED VALUES
DensityISO 11830.9 g/cm³
Melt IndexISO 113315 g/10min
Melting PointDSC146°C
Distortion TemperatureISO 7595°C
Vicat softening temperatureISO 306125°C
Tensile Strength at YieldISO 527280 kg/m²
Tensile Elongation at BreakISO 527300 %
Rockwell hardness R scaleISO 203998
Tensile Strain at BreakISO 527-2 (50mm/min)10 %
Flexural ModulusISO 17810500 kg/m²
Flow ShrinkageFPC Method1.3~1.7 %
LZOD Impact StrengthISO 180/23°C
ISO 180/-20°C
6 kg.cm/cm
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* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.

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