Wafer cushions positioned at the top and bottom of shippers or jars provide added protection for wafer surfaces. They absorb shocks and vibrations, ensuring the wafers remain stable and secure. It can also be paired with a foam liner to form a wafer jars assembly system to ensure the safety and integrity of semiconductor wafers during transportation.
Placed at the bottom and top of the shippers or jars, offer additional safety for the wafer surfaces.
Part Number | Diameter | Thickness |
SCF-150/T3 | 150mm | 3mm |
SCF-150/T6 | 150mm | 6mm |
SCF-200/T3 | 200mm | 3mm |
SCF-200/T6 | 200mm | 6mm |
SCF-300/T3 | 300mm | 3mm |
SCF-300/T6 | 300mm | 6mm |
SCF-400/T3 | 400mm | 3mm |
SCF-400/T6 | 400mm | 6mm |
SCF-295/T3 | 295mm | 3mm |
SCF-295/T6 | 295mm | 6mm |
Material | Polyethylene (EPE) | |
Surface Resistivity | 1x108 ~ 1x1012Ω |
* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236