Tyvek® Separator Paper/Interleaf

- Anti-Static
- Tailored to match various wafer sizes for snug fitting and optimal protection
- Minimizes direct contact and potential damage to wafers during handling and transport
- Suitable for use in wafer canisters and jars
- Resistant to tears and punctures, maintaining integrity during use

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Description

Anti-static spun PO (Tyvek®) as a wafer separators, plays a crucial role in semiconductor packaging. Engineered with anti-static treatment, it combines exceptional strength, lightweight structure, and excellent cleanliness with reliable electrostatic discharge protection, minimizing the risk of particle attraction and damage to sensitive wafers.. The unique nonwoven construction prevents particle shedding and resists tearing, puncture, and microbial penetration, making it ideal for semiconductor, electronics, and cleanroom applications.

Reference Materials

Hiner-pack® Wafer Carrier Series Catalog.pdf

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Application

To provide protection between wafers, preventing direct contact and potential damage during transport and storage. This material is known for its anti-static properties, which are essential in safeguarding sensitive wafer surfaces from electrostatic discharges.

Specifications

Part Number	Diameter	Thickness
DP-150/T0.16	150mm	0.16mm
DP-200/T0.16	200mm	0.16mm
DP-300/T0.16	300mm	0.16mm
DP-400/T0.16	400mm	0.16mm
DP-295/T0.16	295mm	0.16mm