Anti-static spun PO (Tyvek®) as a wafer separators, plays a crucial role in semiconductor packaging. Engineered with anti-static treatment, it combines exceptional strength, lightweight structure, and excellent cleanliness with reliable electrostatic discharge protection, minimizing the risk of particle attraction and damage to sensitive wafers.. The unique nonwoven construction prevents particle shedding and resists tearing, puncture, and microbial penetration, making it ideal for semiconductor, electronics, and cleanroom applications.
To provide protection between wafers, preventing direct contact and potential damage during transport and storage. This material is known for its anti-static properties, which are essential in safeguarding sensitive wafer surfaces from electrostatic discharges.
| Part Number | Diameter | Thickness |
| DP-150/T0.16 | 150mm | 0.16mm |
| DP-200/T0.16 | 200mm | 0.16mm |
| DP-300/T0.16 | 300mm | 0.16mm |
| DP-400/T0.16 | 400mm | 0.16mm |
| DP-295/T0.16 | 295mm | 0.16mm |
* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.
Address
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Tel
+86 755 2322 9236
