Bare Die Tray

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2-inch Bare Die Tray

Reference Factors for Designing Bare Die Tray (Waffle Pack)Avoid any direct pressure or friction on the active surface, bonding pads, or edges of the ...

2026-07-09

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4-inch Bare Die Tray

Reference Factors for Designing Bare Die Tray (Waffle Pack)Designers should ensure that no direct pressure or friction is applied to the die’s active ...

2026-07-09

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Hiner-pack® Exhibiting at SEMICON China 2026 – Visit Us at Booth E6-6755

We are pleased to announce that Hiner-pack® is now exhibiting at SEMICON China 2026, taking place March 25–27, 2026 at the Shanghai New International ...

2026-07-09

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Cover/Lid For 2-inch Waffle Pack

Prevent thin semiconductor dice from shifting out of waffle-pack or chip-tray pockets during shipping and handling. The lid works in tandem with a pre ...

2026-06-27

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Cover/Lid For 4-inch Waffle Pack

Hiner-pack waffle pack cover/lid prevents die from migrating out of waffle pack/chip tray pockets during shipping and handling. Designed to work with ...

2026-06-27

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2-inch Waffle Pack/Chip Tray in Various Colors

Hiner-pack Waffle Pack Chip Trays are engineered for the secure handling and packaging of bare dies, chips, and small semiconductor devices. To meet d ...

2026-06-24

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4-inch Waffle Pack/Chip Tray in Various Colors

Hiner-pack Waffle Pack Trays are purpose-built for safe handling of semiconductor dice, chips, and miniature devices. To streamline operations and ali ...

2026-06-24

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