Built to withstand chemical exposure in advanced wafer cleaning processes
PFA wafer cassettes are designed for the safe transfer, storage, and cleaning of semiconductor wafers in corrosive chemical environments and high-temperature wet process applications. Manufactured from premium perfluoroalkoxy (PFA) or Teflon resin, these wafer carriers provide exceptional resistance to strong acids, hydrofluoric acid, alkaline solutions, and continuous exposure to temperatures up to 220 °C without deformation, degradation, or ionic contamination.
The smooth, translucent surfaces minimize particle generation, simplify cleaning, and maintain wafer integrity throughout critical manufacturing steps. PFA wafer cassettes are compatible with standard wafer processing tools, wet benches, and SMIF/FOUP interface systems, enabling direct transfer between acid baths, wafer etchers, and inspection equipment. Their outstanding chemical resistance, dimensional stability, and ultra-clean design make them ideal for wafer cleaning, etching, and high-temperature processing in advanced semiconductor fabs.
• Handling wafers in high-temperature or corrosive wet processes
• Use in chemical baths for wafer cleaning or etching
• Storage of wafers in environments requiring chemical resistance
• Long-term use in fabs due to superior durability and purity
| BASIC INFORMATION | ||
|---|---|---|
| Part Number | Collocation Reference | Wafer Size |
| MCS-8/25-NP-PFA | -- | 8"/200 mm |
| Metarial | Maximum Capacity | Color |
| PFA | 25 | Transparent |
| Delivery Time | Usually 2-3 weeks, depending on order quantity |
* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.
| TECHNICAL DATA | ||
|---|---|---|
| PROPERTY | TEST METHOD | RATED VALUES |
| Specific Gravity | ASTM D-792 | 2.12~2.17 |
| Water Absorption | ASTM D-570 (24h, 1/3" thick) | <0.01% |
| Molding Shrinkage | -- | 0.04 cm/cm |
| Contact Angle | Angle with Horizontal Surface | 115° |
| Thermal Conductivity | ASTM C-177 | -- |
| Coefficient of Linear Thermal Expansion | ASTM D-696 (23~60°C) | 12x10-5 /°C |
| Melting Point | -- | 302~310 °C |
| Melt Viscosity | -- | 104~105 /°C (380°C) |
| Maximum Continuous Use Temperature | -- | 380°C |
| Tensile Strength | ASTM D-638 (23°C) | 27~31 MPa |
| Elongation | ASTM D-638 (23°C) | 280~300 % |
| Compressive Strength | ASTM D-695 (1%deformation, 25°C) | 5~6 MPa |
| Tensile Resilience | ASTM D-638 (23°C) | -- |
| Flexural Resilience | ASTM D-790 (23°C) | 647~686 MPa |
| Impact Strength | ASTM D-256 (23°C, Izod) | -- |
| Hardness | Durometer | D60 shore |
| Bearing Deformation | ASTM D-621 (100°C, 7MPa, 24h) ASTM D-621 (23°C, 14MPa, 24h) | 2.4 % 2.7 % |
| Static Friction Coefficient | Against Steel | 0.05 |
* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.
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