Cover/Lid For 2-inch Waffle Pack

- Available in static-dissipative, conductive, or standard ESD-safe grades
- Transparent or opaque materials for easy visual inspection or light shielding
- High-purity polymers with low outgassing and minimal particulate release, and clean-room compatible
- Dimensional stability to offset normal tray warpage
- Durable, reusable construction for cost-efficient operations

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Description

Prevent thin semiconductor dice from shifting out of waffle-pack or chip-tray pockets during shipping and handling. The lid works in tandem with a precision-engineered clip that applies even compression across the tray and cover.

Reference Materials

Hiner-pack® 2-inch Waffle Pack & Chip Tray Catalog.pdf

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Application

Used to protect bare die, thin film components, and other fragile devices from particle intrusion, scratches, and displacement within tray pockets, maintaining cleanliness and positional stability throughout wafer-level packaging, R&D sampling, in-process storage, and secure transit between facilities.

Specifications

Part Number	Tray Size & Function	Style	Color	Capacity	Material	Outline Size
HN2097	2" Clip/Clamp	1 Piece Clip	Black	2	Antistatic-PP	55.2×51.5×10.6mm
HN21110	2" Clip/Clamp	1 Piece Clip	Black	2	PP	55×50.61×11mm
HN1923	2" Clip/Clamp	2 Pieces Clip	Black	2	HIPS	55.3×37.3×10.5mm
HN22113	2" Clip/Clamp	Spring Bo×	Black	11	PP	56.12×56×34.98mm
HN1616	2" Cover/Lip	Reverse side with grid-like bumps	Black	N/A	Conductive ABS	50.7×50.7×3.5mm
HN1950	2" Cover/Lip	Reverse side is smooth	Transparent	N/A	Transparent PC	50.7×50.7×3.5mm

Cover/Lid For 2-inch Waffle Pack

Description

Reference Materials

Hiner-pack® 2-inch Waffle Pack & Chip Tray Catalog.pdf

Application

Specifications

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