Prevent thin semiconductor dice from shifting out of waffle-pack or chip-tray pockets during shipping and handling. The lid works in tandem with a precision-engineered clip that applies even compression across the tray and cover.
Used to protect bare die, thin film components, and other fragile devices from particle intrusion, scratches, and displacement within tray pockets, maintaining cleanliness and positional stability throughout wafer-level packaging, R&D sampling, in-process storage, and secure transit between facilities.
| Part Number | Tray Size & Function | Style | Color | Capacity | Material | Outline Size |
|---|---|---|---|---|---|---|
| HN2097 | 2" Clip/Clamp | 1 Piece Clip | Black | 2 | Antistatic-PP | 55.2×51.5×10.6mm |
| HN21110 | 2" Clip/Clamp | 1 Piece Clip | Black | 2 | PP | 55×50.61×11mm |
| HN1923 | 2" Clip/Clamp | 2 Pieces Clip | Black | 2 | HIPS | 55.3×37.3×10.5mm |
| HN22113 | 2" Clip/Clamp | Spring Bo× | Black | 11 | PP | 56.12×56×34.98mm |
| HN1616 | 2" Cover/Lip | Reverse side with grid-like bumps | Black | N/A | Conductive ABS | 50.7×50.7×3.5mm |
| HN1950 | 2" Cover/Lip | Reverse side is smooth | Transparent | N/A | Transparent PC | 50.7×50.7×3.5mm |
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