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4-inch Teflon Wafer Cassette - PFA

- Inert PFA/Teflon resists strong acid/base and HF corrosion
- Withstands temperatures up to approximately 220 °C without degradation or deformation
- Smooth/translucent surface simplifies cleaning
- Supports customization (handles, laser engraving, RFID)

Description

Designed for Wafer Handling in Corrosive or High-Temperature Semiconductor Processes

Engineered for extreme semiconductor manufacturing conditions, PFA wafer cassettes excel in wafer transfer, storage, and wet process cleaning. Constructed from premium perfluoroalkoxy (PFA) or Teflon resin, they offer exceptional resistance to strong acids, hydrofluoric acid, and caustic chemicals, maintaining structural integrity at continuous operating temperatures up to 220 °C. The cassette’s smooth, translucent finish minimizes particle release, simplifies cleaning, and ensures wafer protection throughout processing. Designed to integrate with wafer etchers, wet benches, and SMIF/FOUP-compatible tools, these corrosion-resistant wafer carriers provide reliable, contamination-free handling for high-purity wafer cleaning, etching, and thermal applications in leading semiconductor fabs.

Reference Materials

  • Hiner-pack® 4-inch Teflon Wafer Cassette-PFA.pdf

    557 kB

Application

Handling wafers in high-temperature or corrosive wet processes

Use in chemical baths for wafer cleaning or etching

Storage of wafers in environments requiring chemical resistance

Long-term use in fabs due to superior durability and purity

Specifications

BASIC INFORMATION
Part NumberCollocation ReferenceWafer Size
MCS-4/25-NP-PFA--4"/100 mm
MetarialMaximum CapacityColor
PFA25Transparent
Delivery TimeUsually 2-3 weeks, depending on order quantity

* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.

TECHNICAL DATA
PROPERTYTEST METHODRATED VALUES
Specific GravityASTM D-7922.12~2.17
Water AbsorptionASTM D-570 (24h, 1/3" thick)<0.01%
Molding Shrinkage--0.04 cm/cm
Contact AngleAngle with Horizontal Surface115°
Thermal ConductivityASTM C-177--
Coefficient of Linear Thermal ExpansionASTM D-696 (23~60°C)12x10-5 /°C
Melting Point--302~310 °C
Melt Viscosity--104~105 /°C (380°C)
Maximum Continuous Use Temperature--380°C
Tensile StrengthASTM D-638 (23°C)27~31 MPa
ElongationASTM D-638 (23°C)280~300 %
Compressive StrengthASTM D-695 (1%deformation, 25°C)5~6 MPa
Tensile ResilienceASTM D-638 (23°C)--
Flexural ResilienceASTM D-790 (23°C)647~686 MPa
Impact StrengthASTM D-256 (23°C, Izod)--
HardnessDurometerD60 shore
Bearing DeformationASTM D-621 (100°C, 7MPa, 24h)
ASTM D-621 (23°C, 14MPa, 24h)
2.4 %
2.7 %
Static Friction CoefficientAgainst Steel0.05

* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.

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