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6-inch Teflon Wafer Cassette - PFA

- Inert PFA/Teflon resists strong acid/base and HF corrosion
- Withstands temperatures up to approximately 220 °C without degradation or deformation
- Smooth/translucent surface simplifies cleaning
- Supports customization (handles, laser engraving, RFID)

Description

PFA Wafer Cassettes for High-Purity Semiconductor Wet Processes

PFA wafer cassettes provide unmatched performance in the transfer, storage, and cleaning of semiconductor wafers during high-temperature wet processing and corrosive chemical applications. Molded from high-purity perfluoroalkoxy (PFA) or Teflon resin, these wafer carriers withstand prolonged exposure to strong acids, hydrofluoric acid, and alkaline solutions at temperatures up to 220 °C without warping or contamination. The smooth, translucent surfaces reduce particle generation and enable easy cleaning, safeguarding wafer quality during critical process steps. Compatible with standard wafer handling systems, wet benches, and SMIF/FOUP interfaces, PFA cassettes deliver outstanding chemical resistance, dimensional stability, and ultra-clean performance for advanced wafer etching, cleaning, and processing environments.

Reference Materials

  • Hiner-pack® 6-inch Teflon Wafer Cassette-PFA.pdf

    511 kB

Application

Handling wafers in high-temperature or corrosive wet processes

Use in chemical baths for wafer cleaning or etching

Storage of wafers in environments requiring chemical resistance

Long-term use in fabs due to superior durability and purity

Specifications

BASIC INFORMATION
Part NumberCollocation ReferenceWafer Size
MCS-6/25-NP-PFA--6"/150 mm
MetarialMaximum CapacityColor
PFA25Transparent
Delivery TimeUsually 2-3 weeks, depending on order quantity

* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.

TECHNICAL DATA
PROPERTYTEST METHODRATED VALUES
Specific GravityASTM D-7922.12~2.17
Water AbsorptionASTM D-570 (24h, 1/3" thick)<0.01%
Molding Shrinkage--0.04 cm/cm
Contact AngleAngle with Horizontal Surface115°
Thermal ConductivityASTM C-177--
Coefficient of Linear Thermal ExpansionASTM D-696 (23~60°C)12x10-5 /°C
Melting Point--302~310 °C
Melt Viscosity--104~105 /°C (380°C)
Maximum Continuous Use Temperature--380°C
Tensile StrengthASTM D-638 (23°C)27~31 MPa
ElongationASTM D-638 (23°C)280~300 %
Compressive StrengthASTM D-695 (1%deformation, 25°C)5~6 MPa
Tensile ResilienceASTM D-638 (23°C)--
Flexural ResilienceASTM D-790 (23°C)647~686 MPa
Impact StrengthASTM D-256 (23°C, Izod)--
HardnessDurometerD60 shore
Bearing DeformationASTM D-621 (100°C, 7MPa, 24h)
ASTM D-621 (23°C, 14MPa, 24h)
2.4 %
2.7 %
Static Friction CoefficientAgainst Steel0.05

* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.

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