Why JEDEC Trays Use PPE Material
Dimensional Stability at High Temperatures
Trays must survive reflow soldering processes (MAX 150 °C) without warping.
PPE has excellent heat resistance and low thermal expansion, keeping the tray flat so chips don’t shift or get damaged.
Low Moisture Absorption
PPE absorbs very little water compared to many plastics.
This prevents swelling or warping in humid environments and helps maintain tight dimensional tolerances required for automation.
Good Mechanical Strength & Rigidity
PPE blends are stiff but not brittle.
They resist cracking under load, stacking, or robotic handling.
ESD (Electrostatic Discharge) Safety
JEDEC trays usually require antistatic or conductive grades to protect ICs.
PPE can be compounded with carbon or antistatic additives to achieve stable surface resistivity (10⁴–10¹¹ Ω/sq), making it suitable for semiconductor handling.
Chemical Resistance
Resistant to many solvents, flux residues, and cleaning chemicals used in electronics.
This extends tray lifespan even in tough environments.
Widely used for the packaging, storage, and transportation of IC packages, semiconductor chips, electronic modules, and optical devices.
Material | MPPO, PEI, PES, PPE, ABS, etc. | Outline Size (LxWxT) | 322.6x135.9x12.19mm ("T" is customizable) |
Package Type | BGA, DIP, QFN, QFP, LGA, SOP, etc. | Cavity Size | Customizable |
Color | Black, Red, Yellow, Green, White, etc. | Cavity Quantity | Customizable |
Mold Type | Injection Molding | Flatness/Warpage | MAX 0.76mm |
Surface Resistance | 1.0x104~1.0x1011Ω/sq | Certificate | RoHS |
Service | Accept OEM and ODM | ||
Design | Based on original samples, or custom designs can be created | ||
Packing | By carton or according to customer’s request | ||
Sample | Sample charge: 1. Free for stock samples 2. Custom tray samples to be negotiated Sample time: After the draft is confirmed and payment is arranged | ||
Lead Time | 5-7 Working days (The exact lead time depends on the order quantity) |