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JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...

2026-07-09

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Velcro Straps For JEDEC Tray

This Velcro straps are specially designed accessories for securing stacked JEDEC trays during storage and transportation. They provide a reusable, fle ...

2026-07-09

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JEDEC Tray For DIP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with DIP PackagingAbsolutely do not contact or compress the leads: Any positioning/supporting s ...

2026-07-09

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JEDEC Tray For RFIC

Reference Factors for Designing Trays for RFICsAbsolutely do not contact any RF-sensitive surfaces (antenna/output port/exposed die/solder pad/bond-pa ...

2026-07-09

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JEDEC Trays in Various Colors

Hiner-pack JEDEC trays are not only designed for reliable semiconductor and electronic component handling but also support full customization in color ...

2026-07-09

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JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2026-07-09

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JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2026-07-09

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JEDEC Tray – PEI Material

Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...

2026-07-09

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JEDEC Tray For Module Packages

Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...

2026-07-09

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JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...

2026-07-09

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