jedec tray

Home > Tags > Find "jedec tray" Related Content

JEDEC Tray For QFN Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFN PackagingDo not contact the solder pads/exposed thermal pad and lead surface: No suppo ...

2026-07-09

View More
JEDEC Tray For QFP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFP PackagingFirstly, the body dimensions, lead tip-to-tip spacing, and lead height serve ...

2026-07-09

View More
JEDEC Tray For LGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with LGA PackagingAbsolutely do not contact the exposed lands/contact surfaces: No positioning/ ...

2026-07-09

View More
JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2026-07-09

View More
JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2026-07-09

View More
JEDEC Tray – PEI Material

Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...

2026-07-09

View More
JEDEC Tray For Module Packages

Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...

2026-07-09

View More
End-Clips For JEDEC Tray

End-clips are small identification accessories designed to be attached to both ends of JEDEC trays. With their compact size and availability in multip ...

2026-07-09

View More
JEDEC Tray Cover

JEDEC tray covers are protective lids designed to shield components inside JEDEC trays from dust, static, and mechanical damage. They fit securely ove ...

2026-07-09

View More
JEDEC Tray 3D Sample

JEDEC tray 3D samples are prototype models created to visualize and verify tray designs before mass production. They allow engineers to evaluate dimen ...

2026-07-09

View More

«
1
2
3
4
5
6
»

Category

ABOUT US 

Company Profile Factory Tour Quality Control
PRODUCTS 

Wafer Carrier Series Wafer Shipper Accessories JEDEC Tray/IC Tray Waffle Pack/Chip Tray Gel Box/Vacuum Release Box
CASES 
NEWS 
DOWNLOADS 
Blog 
CONTACT US 

Hot Tags

Hot Cases

New Articles

Quick Link

About Us Products Cases News Blogs Contact Us

Products

Wafer Carrier Series Wafer Shipper Accessories JEDEC Tray/IC Tray Waffle Pack/Chip Tray Gel Box/Vacuum Release Box

Quick Contact

Address

Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province, CN

Tel

+1 (408) 669-7847

E-mail

rainbowzhu@hiner-pack.com

weixin

Get a Quote

Please fill in all * fields below, we will get back to you as soon as possible.

The Pioneer of R&D and Application in Semiconductor Carrier Products. Copyright Copyright © 2021-2026 Shenzhen Hiner Technology Co., Ltd. All Rights Reserved.

Sitemap

wechat

