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4-inch Waffle Pack - ABS Material

Why Waffle Pack Uses ABS Material (Acrylonitrile Butadiene Styrene)Impact ResistanceABS delivers robust toughness and shock absorption. Trays molded f ...

2025-09-30

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4-inch Bare Die Tray

Reference Factors for Designing Bare Die Tray (Waffle Pack)Designers should ensure that no direct pressure or friction is applied to the die’s active ...

2025-09-30

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2-inch Bare Die Tray

Reference Factors for Designing Bare Die Tray (Waffle Pack)Avoid any direct pressure or friction on the active surface, bonding pads, or edges of the ...

2025-09-30

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2-inch Waffle Pack - ABS Material

Why Waffle Pack Uses ABS Material (Acrylonitrile Butadiene Styrene)Impact ResistanceABS offers excellent toughness and impact resistance.Waffle packs ...

2025-09-30

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Wafer Handling Boxes: Essential Components in Semiconductor Manufacturing

In the highly precise and demanding world of semiconductor manufacturing, every component plays a critical role in ensuring the integrity and efficien ...

2025-09-29

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Semiconductor Cassette: A Comprehensive Guide to Wafer Boxes, Handling, Carriers, and Shipping

In the highly precise world of semiconductor manufacturing, every component plays a critical role in ensuring the integrity and efficiency of the prod ...

2025-09-24

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Metal Package and Testing Cassette: Key Components for Semiconductor Reliability

In the world of semiconductor manufacturing and testing, the integrity of the device from fabrication to end-use is paramount. The metal package and t ...

2025-09-22

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High-Density Wafer Storage: Maximizing Efficiency and Space in Semiconductor Fabs

In the fast-paced world of semiconductor manufacturing, every square foot of cleanroom space is extraordinarily valuable. The relentless drive towards ...

2025-09-19

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JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...

2025-09-11

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JEDEC Tray For QFN Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFN PackagingDo not contact the solder pads/exposed thermal pad and lead surface: No suppo ...

2025-09-11

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JEDEC Tray For QFP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFP PackagingFirstly, the body dimensions, lead tip-to-tip spacing, and lead height serve ...

2025-09-11

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JEDEC Tray For LGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with LGA PackagingAbsolutely do not contact the exposed lands/contact surfaces: No positioning/ ...

2025-09-11

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JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2025-09-11

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JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2025-09-11

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Snap-on Clips For 4-inch Waffle Pack

Waffle Pack/Chip Tray Clip is an accessory that locks the tray and cover together by applying uniform compression along the tray edges. This prevents ...

2025-11-04

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Velcro Straps For JEDEC Tray

This Velcro straps are specially designed accessories for securing stacked JEDEC trays during storage and transportation. They provide a reusable, fle ...

2025-09-11

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End-Clips For JEDEC Tray

End-clips are small identification accessories designed to be attached to both ends of JEDEC trays. With their compact size and availability in multip ...

2025-09-11

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JEDEC Tray For DIP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with DIP PackagingAbsolutely do not contact or compress the leads: Any positioning/supporting s ...

2025-09-11

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JEDEC Tray For RFIC

Reference Factors for Designing Trays for RFICsAbsolutely do not contact any RF-sensitive surfaces (antenna/output port/exposed die/solder pad/bond-pa ...

2025-09-11

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JEDEC Trays in Various Colors

Hiner-pack JEDEC trays are not only designed for reliable semiconductor and electronic component handling but also support full customization in color ...

2025-09-11

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