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JEDEC Tray For LGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with LGA PackagingAbsolutely do not contact the exposed lands/contact surfaces: No positioning/ ...

2025-09-11

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1 Piece Clips For 4-inch Waffle Pack

Waffle Pack/Chip Tray Clip is an accessory that locks the tray and cover together by applying uniform compression along the tray edges. This prevents ...

2025-11-04

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JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2025-09-11

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2 Pieces Clips For 4-inch Waffle Pack

Waffle Pack/Chip Tray Clip is an accessory that locks the tray and cover together by applying uniform compression along the tray edges. This prevents ...

2025-11-04

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JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2025-09-11

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Snap-on Clips For 4-inch Waffle Pack

Waffle Pack/Chip Tray Clip is an accessory that locks the tray and cover together by applying uniform compression along the tray edges. This prevents ...

2025-11-04

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JEDEC Tray – PEI Material

Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...

2025-09-11

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Cover/Lid For 4-inch Waffle Pack

Hiner-pack waffle pack cover/lid prevents die from migrating out of waffle pack/chip tray pockets during shipping and handling. Designed to work with ...

2025-11-04

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JEDEC Tray For Module Packages

Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...

2025-09-11

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JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...

2025-09-11

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End-Clips For JEDEC Tray

End-clips are small identification accessories designed to be attached to both ends of JEDEC trays. With their compact size and availability in multip ...

2025-09-11

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JEDEC Tray For DIP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with DIP PackagingAbsolutely do not contact or compress the leads: Any positioning/supporting s ...

2025-09-11

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JEDEC Tray Cover

JEDEC tray covers are protective lids designed to shield components inside JEDEC trays from dust, static, and mechanical damage. They fit securely ove ...

2025-09-11

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JEDEC Tray For RFIC

Reference Factors for Designing Trays for RFICsAbsolutely do not contact any RF-sensitive surfaces (antenna/output port/exposed die/solder pad/bond-pa ...

2025-09-11

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JEDEC Tray 3D Sample

JEDEC tray 3D samples are prototype models created to visualize and verify tray designs before mass production. They allow engineers to evaluate dimen ...

2025-09-11

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JEDEC Trays in Various Colors

Hiner-pack JEDEC trays are not only designed for reliable semiconductor and electronic component handling but also support full customization in color ...

2025-09-11

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JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2025-09-11

View More
JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2025-09-11

View More
JEDEC Tray – PEI Material

Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...

2025-09-11

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JEDEC Tray For Module Packages

Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...

2025-09-11

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