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Wafer Carrier Series
12-inch Wafer Shippers
12-inch Vertical Flex Frame Wafer Shipper - Conductive PP
12-inch Horizontal Flex Frame Wafer Shipper
12-inch Horizontal Wafer Shipper
12-inch Vacuum-Formed Flex Frame Single Wafer Shipper - Black PET
12-inch Vacuum-Formed Flex Frame Single Wafer Shipper - Clear PET
8-inch Wafer Shippers
8-inch Horizontal Flex Frame Wafer Shipper - 13PCS
8-inch Clamshell-Style Hoop Ring Single Wafer Shipper
8-inch Wafer Jar - Transparent Cover
8-inch Vertical Wafer Shipper - Nature PP
8-inch Horizontal Flex Frame Wafer Shipper - 25PCS
6-inch Wafer Shippers
6-inch Wafer Jar - White Cover
6-inch Vertical Wafer Shipper - Nature PP
6-inch Coin-Style Single Wafer Shipper - Nature PP
6-inch Wafer Jar - Transparent Cover
6-inch Wafer Cassette - Nature PP
4-inch Wafer Shippers
4-inch Vertical Wafer Shipper - Nature PP
4-inch Coin-Style Single Wafer Shipper - Nature PP
4-inch Wafer Cassette - Nature PP
4-inch Teflon Wafer Cassette - PFA
152/141 & 135/123 mm Vacuum-Formed Hoop Ring Single Wafer Shipper - Black PET
Metal Carrier Series
Metal Wafer Cassette With Teflon Coating For BGA
Metal Package & Testing Cassette
Metal Expander/Hoop Ring Wafer Cassette With 5 Slots
Metal Wafer Cassette
QFN Lead Frame Magazine
Wafer Shipper Accessories
Hoop/Expander Rings
Clamp Ring/Ring Separator
Plastic Flex Frame Rings
Metal Flex Frame Rings
Tyvek® Separator Paper/Interleaf
JEDEC Tray/lC Tray
JEDEC Tray (thickness 12.19mm)
JEDEC Tray For BGA Packages
JEDEC Tray For DIP Packages
JEDEC Tray For RFIC
JEDEC Trays in Various Colors
JEDEC Tray – MPPO Material
JEDEC Tray (thickness 7.62mm)
JEDEC Tray For BGA Packages
JEDEC Tray For QFN Packages
JEDEC Tray For QFP Packages
JEDEC Tray For LGA Packages
JEDEC Tray – MPPO Material
JEDEC Tray Accessories
Velcro Straps For JEDEC Tray
End-Clips For JEDEC Tray
JEDEC Tray Cover
JEDEC Tray 3D Sample
Waffle Pack/Chip Tray
2-inch Waffle Pack/Chip Tray
2-inch Waffle Pack/Chip Tray in Various Colors
2-inch Bare Die Tray
2-inch Waffle Pack - PC Material
2-inch Waffle Pack - ABS Material
4-inch Waffle Pack/Chip Tray
4-inch Waffle Pack/Chip Tray in Various Colors
4-inch Bare Die Tray
4-inch Waffle Pack - PC Material
4-inch Waffle Pack - ABS Material
Waffle Pack Accessories
1 Piece Clips For 2-inch Waffle Pack
2 Pieces Clips For 2-inch Waffle Pack
Spring Box For 2-inch Waffle Pack
Cover/Lid For 2-inch Waffle Pack
1 Piece Clips For 4-inch Waffle Pack
Gel Box/Vacuum Release Box
Gel Box - HN#5510
Gel Box - HN#7515
Gel Box - HN#8512
Gel Box - HN#12012
Gel Box - HN#15020
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JEDEC Tray
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JEDEC Tray For BGA Packages
Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...
2025-09-10
View More
JEDEC Tray For QFN Packages
Reference Factors for Designing JEDEC TRAYs Compatible with QFN PackagingDo not contact the solder pads/exposed thermal pad and lead surface: No suppo ...
2025-09-10
View More
JEDEC Tray For QFP Packages
Reference Factors for Designing JEDEC TRAYs Compatible with QFP PackagingFirstly, the body dimensions, lead tip-to-tip spacing, and lead height serve ...
2025-09-10
View More
JEDEC Tray For LGA Packages
Reference Factors for Designing JEDEC TRAYs Compatible with LGA PackagingAbsolutely do not contact the exposed lands/contact surfaces: No positioning/ ...
2025-09-10
View More
JEDEC Tray – MPPO Material
Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...
2025-09-10
View More
JEDEC Tray – PPE Material
Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...
2025-09-10
View More
JEDEC Tray – PEI Material
Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...
2025-09-10
View More
JEDEC Tray For Module Packages
Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...
2025-09-10
View More
Velcro Straps For JEDEC Tray
This Velcro straps are specially designed accessories for securing stacked JEDEC trays during storage and transportation. They provide a reusable, fle ...
2025-09-10
View More
JEDEC Tray For BGA Packages
Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...
2025-09-10
View More
End-Clips For JEDEC Tray
End-clips are small identification accessories designed to be attached to both ends of JEDEC trays. With their compact size and availability in multip ...
2025-09-10
View More
JEDEC Tray For DIP Packages
Reference Factors for Designing JEDEC TRAYs Compatible with DIP PackagingAbsolutely do not contact or compress the leads: Any positioning/supporting s ...
2025-09-10
View More
JEDEC Tray Cover
JEDEC tray covers are protective lids designed to shield components inside JEDEC trays from dust, static, and mechanical damage. They fit securely ove ...
2025-09-10
View More
JEDEC Tray For RFIC
Reference Factors for Designing Trays for RFICsAbsolutely do not contact any RF-sensitive surfaces (antenna/output port/exposed die/solder pad/bond-pa ...
2025-09-10
View More
JEDEC Tray 3D Sample
JEDEC tray 3D samples are prototype models created to visualize and verify tray designs before mass production. They allow engineers to evaluate dimen ...
2025-09-10
View More
JEDEC Trays in Various Colors
Hiner-pack JEDEC trays are not only designed for reliable semiconductor and electronic component handling but also support full customization in color ...
2025-09-10
View More
JEDEC Tray – MPPO Material
Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...
2025-09-10
View More
JEDEC Tray – PPE Material
Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...
2025-09-10
View More
JEDEC Tray – PEI Material
Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...
2025-09-10
View More
JEDEC Tray For Module Packages
Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...
2025-09-10
View More
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ABOUT US
Company Profile
Factory Tour
Quality Control
VR Show
PRODUCTS
Wafer Carrier Series
Wafer Shipper Accessories
JEDEC Tray/lC Tray
Waffle Pack/Chip Tray
Gel Box/Vacuum Release Box
CASES
NEWS
DOWNLOADS
CONTACT US
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